XI'AN YUMU ELECTRONICS TECHNOLOGY CO.,LTD
XI'AN YUMU ELECTRONICS TECHNOLOGY CO.,LTD
Home> PRODUCTS> Aircraft Switch> Aviation Band Switch> Aviation Switch Inches Switch WK3-1
Aviation Switch Inches Switch WK3-1
Aviation Switch Inches Switch WK3-1
Aviation Switch Inches Switch WK3-1
Aviation Switch Inches Switch WK3-1

Aviation Switch Inches Switch WK3-1

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Product Description
Product Attributes

Model No.WK3-1

BrandYM

SpeciesEngine

Use AircraftHelicopters

Old And NewNew

Packaging & Delivery
Aviation Band Switch

WK3-1 Aviation Inches Switch:

Ultra-Miniature High-Precision Switching Solution

Product Overview

The WK3-1 is an ultra-miniature Aviation Inches Switch engineered for space-critical applications in drone systems, aircraft engines, train controls, and precision Aviation Electronics. Representing the pinnacle of miniaturization technology, this switch delivers full military-grade performance in an exceptionally compact footprint. As part of YM's specialized miniature components portfolio—complementing products like Aviation Microswitches and PCB Signal Relays—the WK3-1 enables advanced system designs where space constraints previously limited functionality and reliability.

WK3-1 Aviation Inches Switch ultra-miniature technical diagram
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Technical Specifications

  • Model Number: WK3-1
  • Switch Type: Ultra-miniature aviation inches switch
  • Dimensions: Precision inches-scale footprint (exact dimensions upon request)
  • Electrical Rating: 1A at 28V DC resistive load
  • Coil Power Consumption: (0.3 - 0.43) Watts
  • Electrical Life: Minimum 100,000 switching operations
  • Low-Level Signal Capability: (10-50) μA at (10-50) mV for precision signal applications
  • Contact Resistance: Initial ≤50mΩ; After durability testing ≤200mΩ
  • Switching Speed: Action time ≤4ms; Release time ≤4ms; Pulse width (10-50) ms
  • Actuation Force: Precision-engineered for miniature applications
  • Dielectric Strength: 500V RMS @ 50Hz (standard); 250V RMS @ 50Hz (low pressure)
  • Insulation Resistance: >500 MΩ initially; >50 MΩ after environmental testing
  • Weight: Less than 3 grams (ultra-lightweight design)
  • Environmental Sealing: Maximum leakage rate ≤ 1.0 x 10⁻³ Pa·cm³/s
  • Operating Temperature: Performance validated for aviation conditions, compatible with Aviation Temperature Sensor ranges
  • Mounting Style: Micro-precision mounting for inches-scale applications

Product Features & Competitive Advantages

  1. Ultra-Miniature Footprint: Engineered to the smallest possible dimensions while maintaining full electrical performance, enabling integration in applications where conventional switches are physically impossible—complementing space-optimized systems using PCB Board Relays.
  2. Precision Micro-Engineering: Manufactured using advanced micro-machining techniques that maintain tight tolerances and consistent performance across production batches.
  3. Advanced Hermetic Sealing at Micro Scale: Micro-precision sealing technology (≤10⁻³ Pa·cm³/s) provides environmental protection comparable to Aviation Oil Sealed Valves in a miniature package.
  4. Vibration-Resistant Micro-Design: Engineered to withstand aviation-level vibration and shock despite miniature size, using innovative internal damping techniques.
  5. Low-Actuation Force Design: Optimized for applications with limited mechanical force availability while maintaining positive switching action.
  6. Thermal Stability: Maintains performance across aviation temperature ranges despite miniature thermal mass constraints.

Installation and Handling Procedures for Miniature Components

  1. Pre-Installation Planning: Verify space constraints and mounting requirements specific to miniature component installation.
  2. Specialized Tool Preparation: Use micro-tools and magnification equipment appropriate for inches-scale component handling.
  3. Clean Environment Setup: Work in controlled environment to prevent contamination of miniature components during installation.
  4. Precision Mounting: Use micro-precision alignment techniques and appropriate adhesives or micro-fasteners for secure mounting.
  5. Micro-Wiring Connection: Employ precision wiring techniques with appropriate gauge wire for miniature current requirements.
  6. Sealing Verification at Micro Scale: Confirm microscopic sealing integrity using appropriate inspection methods.
  7. Functional Testing: Test with micro-probe equipment to verify electrical performance without damaging miniature components.
  8. System Integration: Carefully integrate with other miniature components like Aviation Microswitches or sensor systems.

Application Scenarios

The WK3-1 Aviation Inches Switch is engineered for the most space-constrained applications across multiple industries:

  • Micro-UAV and Nano-Drone Systems: Control switching in palm-sized drones, micro-aerial vehicles, and insect-scale robotics where every milligram and cubic millimeter matters.
  • Aircraft Miniature Avionics: Space-critical locations in advanced avionics systems, head-up displays, and miniaturized instrument clusters.
  • Wearable Aviation Technology: Integrated into pilot helmets, wearable displays, and portable Aviation Equipment where size and weight are critically limited.
  • Medical Aviation Devices: Miniature controls in portable medical equipment, emergency response gear, and airborne medical systems.
  • Precision Instrumentation: Control functions in miniaturized test equipment, portable measurement devices, and field calibration tools.
  • Satellite and Spacecraft Micro-Systems: Applications where component miniaturization directly impacts mission payload capacity and success.
  • Advanced Sensor Packages: Integration into miniaturized sensor arrays, distributed sensor networks, and smart material systems.
  • Portable Military Electronics: Tactical communications equipment, field computing devices, and soldier-worn technology.

Value Proposition for Miniaturized System Design

  • Enable Next-Generation Miniaturization: Allows system designs previously impossible due to switch size limitations, opening new possibilities in product development.
  • Weight Reduction Critical for Aviation: Ultra-lightweight construction contributes directly to overall system weight savings with measurable impact on fuel efficiency and payload capacity.
  • Increased Functional Density: Enables higher component density in advanced electronics, supporting the trend toward more capable, compact systems.
  • Reliability in Miniature Form: Proves that miniaturization doesn't require compromising on reliability, with military-grade performance maintained despite size reduction.
  • Design Flexibility: Provides switching solutions for applications where traditional components simply won't fit, enabling innovative design approaches.
  • Competitive Advantage: Offers product differentiation through advanced miniaturization capabilities not available with conventional components.
  • Future-Proof Technology: Positions products at the forefront of the miniaturization trend in aerospace and electronics industries.

Certifications & Compliance

The WK3-1 Aviation Inches Switch is designed and manufactured to meet or exceed performance requirements for miniature components in aerospace applications, including specialized standards for micro-component reliability, military specifications for miniaturized tactical equipment, and aviation requirements for space-constrained systems. Our micro-manufacturing processes comply with stringent quality management systems adapted for miniature component production, and we provide comprehensive technical documentation including micro-scale performance data to support customer qualification and certification efforts for advanced miniaturized systems.

Customization & OEM/ODM Services

YM offers specialized customization for the WK3-1 inches switch series for unique miniaturization requirements:

  • Custom dimensions and form factors for specific space constraints
  • Specialized actuation mechanisms for micro-mechanical systems
  • Custom electrical characteristics for specific micro-circuit requirements
  • Enhanced micro-sealing for unique environmental challenges
  • Special mounting and interface configurations for integration with micro-assemblies
  • Custom marking and identification for miniature component traceability
  • Application-specific testing protocols for micro-component reliability
  • Integration services with other miniature components from our portfolio

Our expertise in OEM and ODM services for precision miniature components, demonstrated across our PCB Signal Relay and micro-component product lines, ensures we can develop tailored inches switch solutions that precisely match your most challenging space constraints and performance requirements.

Production Process & Micro-Scale Quality Assurance

  1. Micro-Precision Manufacturing: Advanced micro-machining and micro-stamping processes create components with sub-millimeter precision.
  2. Clean Room Production: Manufacturing in controlled environments to prevent contamination of miniature components.
  3. Micro-Assembly Techniques: Specialized assembly processes using micro-manipulation equipment and microscopic alignment.
  4. Micro-Scale Plating: Precision electroplating processes adapted for miniature component surfaces.
  5. Micro-Electrical Testing: Specialized testing equipment with micro-probes for electrical performance verification without component damage.
  6. Micro-Sealing Validation: Advanced sealing integrity testing adapted for miniature component scales.
  7. Magnified Inspection: High-magnification visual inspection of all critical features and assemblies.
  8. Micro-Traceability Systems: Complete manufacturing traceability using micro-marking and specialized tracking systems for miniature components.

System Integration with Complementary Miniature Components

The WK3-1 Aviation Inches Switch is designed for integration into advanced miniaturized systems. For complete micro-system solutions, consider pairing with YM's complementary miniature products such as Aviation Microswitches for additional sensing functions, ultra-compact PCB Signal Relays for signal conditioning, and miniature Aviation Temperature Sensors for environmental monitoring in compact assemblies. This integrated micro-component approach enables the creation of sophisticated, space-optimized systems for next-generation aerospace, defense, and technology applications where miniaturization represents a critical competitive advantage and technological frontier.

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