Micro-D Subminiature Sealed Connector System
Product Overview
The YM Military Aviation Connector Y11P-1419ZK10 is an ultra-compact, high-density Micro-D subminiature connector engineered for space-critical applications in aerospace, unmanned systems, and advanced industrial controls. Designed to meet the rigorous demands of drone avionics, aircraft sensor networks, and miniaturized control systems, this connector provides reliable signal transmission in the most confined spaces while maintaining military-grade environmental protection. As part of YM's comprehensive interconnect solutions—which include precision components like PCB Signal Relays and Solid State Relays—the Y11P-1419ZK10 delivers exceptional performance where size, weight, and reliability are paramount design considerations.
Core Advantage: Ultra-compact Micro-D design with high contact density and superior environmental sealing, providing reliable interconnection in applications where traditional connectors are too large but performance requirements remain uncompromised.
Technical Specifications
- Model: Y11P-1419ZK10
- Connector Type: Micro-D Subminiature, Metal Shell
- Shell Configuration:
- Shell Size: Ultra-compact Micro-D footprint (significantly smaller than standard D-Sub)
- Material: Steel or aluminum alloy with corrosion-resistant plating
- Mounting: Surface mount or panel mount options available
- Contact System:
- Contact Pitch: 0.050" (1.27mm) or 0.025" (0.635mm) spacing options
- Contact Types: Machined contacts with selective gold plating
- Current Rating: Signal contacts rated 1-3A, suitable for interfacing with PCB Board Relays
- Contact Resistance: ≤25mΩ maximum per contact
- Contact Density: High-density arrangement maximizing pin count in minimal space
- Electrical Performance:
- Voltage Rating: 250V AC/DC working voltage
- Insulation Resistance: >1000 MΩ at 500V DC
- Dielectric Strength: 750V AC RMS between adjacent contacts
- EMI/RFI Shielding: Effective through metal shell construction
- Environmental & Mechanical:
- Ingress Protection: IP67 when properly mated
- Operating Temperature: -55°C to +125°C
- Sealing System: Advanced micro-sealing technology
- Vibration Resistance: 10-2000Hz, 10G acceleration
- Shock Resistance: 100G, 6ms duration
- Coupling Mechanism: Screw lock or snap-lock options
- Mating Cycles: Minimum 500 cycles
Product Features & Advantages
- Ultra-Compact Micro-D Design: Significantly smaller than standard D-Sub connectors while maintaining similar pin counts, enabling high-density interconnection in space-constrained applications like drone flight controllers and miniaturized avionics.
- Advanced Micro-Sealing Technology: Features precision-engineered sealing systems that provide complete environmental protection despite the small form factor, offering reliability comparable to our Metal Sealing Relays in harsh conditions.
- Superior EMI/RFI Shielding: Full-metal shell construction with optimized grounding paths provides excellent electromagnetic interference protection, critical when connecting to sensitive devices like Solid State Relays or high-speed communication equipment.
- High-Density Contact Arrangement: Maximizes signal transmission capabilities in minimal space, allowing complex control systems with multiple PCB Signal Relays to be interconnected efficiently.
- Robust Mechanical Design: Despite small size, features reinforced construction with positive-lock coupling mechanisms ensuring reliable performance under vibration and mechanical stress in aerospace applications.
- Precision Manufacturing: Requires advanced manufacturing techniques to achieve the tight tolerances necessary for reliable performance in the micro-scale form factor.
Our Manufacturing Advantage: YM leverages advanced precision manufacturing capabilities—developed through producing Military Metal Relays and Polarized Relays—to create Micro-D connectors with exceptional dimensional accuracy, reliable micro-sealing surfaces, and precision gold contacts that ensure long-term electrical stability in demanding applications.
How to Specify and Install the Y11P-1419ZK10 Connector
- Space and Requirements Analysis: Evaluate available space and signal requirements. Micro-D connectors are ideal when standard D-Subs are too large but high pin counts are needed.
- Component Selection: Choose appropriate pin count (typically 9, 15, 21, 25, 31, 37, 51 positions) and select surface mount or through-hole mounting style based on PCB design.
- PCB Layout Considerations: Design PCB with proper pad patterns and clearance for the Micro-D connector. Consider thermal management during soldering due to small size.
- Assembly Process: Use precision soldering techniques (reflow recommended for surface mount versions). Ensure proper alignment before soldering.
- Mating and Testing: Align connectors carefully (polarization features prevent incorrect mating). Secure with locking mechanism. Perform electrical verification tests including continuity and insulation resistance checks.
Application Scenarios
The Y11P-1419ZK10 Micro-D connector is essential for ultra-compact interconnection in advanced technology applications:
- Miniature Drone and UAV Electronics: Primary interface for micro flight controllers, miniature sensor arrays, and compact payload systems where every gram and cubic millimeter counts.
- Aircraft Avionics Upgrades: Used in retrofit applications where space is limited but additional instrumentation or control signals are required.
- Portable Military Equipment: Provides reliable connections for man-portable communication devices, handheld targeting systems, and dismounted soldier electronics.
- Medical and Scientific Instrumentation: Ideal for portable medical devices, laboratory equipment, and scientific instruments requiring reliable connections in compact packages.
- Industrial Miniaturization: Used in compact industrial controls, miniature robotics, and automation equipment where space optimization is critical.
- Advanced Transportation Systems: Suitable for compact control modules in next-generation transportation systems where space and weight savings are design priorities.
Value for Buyers: Enables dramatic size and weight reduction in end products, allows for higher integration density in electronic designs, maintains reliability despite small form factor, provides robust environmental protection in miniature packages, and supports advanced miniaturization trends across multiple industries.
Certifications & Compliance
Manufactured in our SGS-audited facility under ISO 9001 certified quality management systems, the Y11P-1419ZK10 connector series is designed and tested to meet MIL-DTL-83513 specifications for Micro-D connectors and other relevant international standards. Our advanced manufacturing processes ensure full compliance with RoHS and REACH directives. While standard products meet these rigorous specifications, project-specific certifications (UL, CE) can be supported, consistent with our proven capability in supplying certified components like Automotive Relays.
Customization Options
YM offers specialized customization capabilities for the Y11P-1419ZK10 Micro-D connector system:
- Custom Pin Configurations: Design of specialized contact arrangements including mixed signal layouts for specific miniaturized applications.
- Specialized Mounting Options: Custom surface mount configurations, right-angle designs, or special mounting features for unique installation requirements.
- Enhanced Sealing Solutions: Advanced micro-sealing technologies for specific environmental protection requirements in miniature applications.
- Special Materials and Platings: Custom plating options for improved corrosion resistance or specific electrical characteristics in challenging environments.
- Complete Assembly Services: Pre-assembled connector-cable systems with precision terminations for plug-and-play installation in miniaturized systems.
- Special Marking and Identification: Micro-laser marking for part numbers, orientation indicators, or other identification needs in compact applications.
Our extensive OEM/ODM experience in miniaturized components, demonstrated through development of compact Flash Relays and specialized PCB Board Relays, enables us to engineer Micro-D connector solutions that perfectly match your advanced miniaturization requirements.
Production & Quality Control Process
Every Y11P-1419ZK10 Micro-D connector undergoes rigorous manufacturing and testing processes to ensure premium quality:
- Precision Stamping and Forming: Contacts are precision stamped using advanced micro-stamping technology to achieve the tight tolerances required for Micro-D applications.
- Advanced Plating Processes: Selective gold plating applied with precision control to ensure optimal electrical performance while managing costs.
- Micro-Molding Technology: Insulators are injection molded using high-precision micro-molding equipment with exacting dimensional control.
- Precision Assembly: Specialized assembly equipment handles the small components with the accuracy needed for reliable Micro-D connector performance.
- Automated Optical Inspection: 100% automated optical inspection of critical dimensions and features using advanced vision systems.
- Comprehensive Electrical Testing: Each connector undergoes rigorous electrical testing including continuity, insulation resistance, and dielectric strength verification.
- Environmental Testing: Sample testing for vibration, shock, and environmental sealing to ensure performance in demanding applications.
This comprehensive quality assurance program, aligned with the exacting standards required for our Solid State Relays and other precision micro-components, guarantees connectors that deliver uncompromising reliability in the most demanding miniaturized applications where failure is not an option.
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